FILE NAME: bonding-1.0.0-6.src.rpm TITLE: HP Tested and Approved Linux Bonding Driver VERSION: 1.0.0-6HP LANGUAGE: English CATEGORY: Software Solutions DIVISIONS: Enterprise and Mainstream Servers PRODUCTS AFFECTED: Compaq NC3120 Fast Ethernet Adapter (e100) Compaq NC3121 Fast Ethernet Adapter (e100) Compaq NC3122 Fast Ethernet Adapter (e100) Compaq NC3123 Fast Ethernet Adapter (e100) Compaq NC3131 Fast Ethernet Adapter (e100) Compaq NC3132 Fast Ethernet Adapter (e100) Compaq NC3133 Fast Ethernet Adapter (e100) Compaq NC3134 Fast Ethernet Adapter (e100) Compaq NC3135 Fast Ethernet Adapter (e100) Compaq NC3163 Fast Ethernet Adapter (e100) Compaq NC6132 Gigabit Server Adapter (e1000) Compaq NC6133 Gigabit Server Adapter (e1000) Compaq NC6134 Gigabit Server Adapter (e1000) Compaq NC6136 Gigabit Server Adapter (e1000) Compaq NC6770 Gigabit Server Adapter (bcm5700) Compaq NC7131 Gigabit Server Adapter (e1000) Compaq NC7132 Gigabit Server Adapter (e1000) Compaq NC7760 Gigabit Server Adapter (bcm5700) Compaq NC7770 Gigabit Server Adapter (bcm5700) Compaq NC7771 Gigabit Server Adapter (bcm5700) Compaq NC7780 Gigabit Server Adapter (bcm5700) Compaq NC7781 Gigabit Server Adapter (bcm5700) OPERATING SYSTEM: Red Hat Linux 7.3 Professional with errata kernel 2.4.18-10 Red Hat Linux 8.0 Professional Red Hat Linux Advanced Server 2.1 with errata kernel 2.4.9-e.8 SuSE Linux Enterprise Server 7 (SLES-7) with SMP errata kernel 2.4.18-224 or UP errata kernel 2.4.18-243 PREREQUISITES: Pentium based computer 128MB RAM minimum Latest Compaq system ROM bcm5700 driver version 2.2.30 e100 driver version 2.1.6d e1000 driver version 4.3.2c Note: Please visit the following URL to upgrade the ROM http://www.compaq.com/support/files/ EFFECTIVE DATE: 10/31/2002 SUPERSEDES: NONE DESCRIPTION: This RPM Package contains the HP Tested and Approved Linux bonding driver for use with HP Server Adapters mentioned in the PRODUCTS AFFECTED section of this document. ENHANCEMENTS/FIXES: Documentation enhancements Fix memory leak More robust parameter checking Fix ARP monitoring Table of Contents ================= Introduction Packaging Kernel Source Code Setup Installing Source RPM Package Bond Configuration Module Parameters Driver Messages Uninstalling the RPM Introduction ============ This package provides a driver module (bonding.o) and the ifenslave utility used to configure teaming. After installation, additional information can be found in the bonding.txt file located at: For Red Hat: /usr/share/doc/bonding-1.0.0/bonding.txt For SuSE: /usr/share/doc/packages/bonding/bonding.txt Packaging ========= The driver is released in the source RPM format. The file name for the package is bonding-.src.rpm and is dependent on the kernel source code. Kernel Source Code Setup ======================== The bonding driver requires the presence of the kernel source code and configuring the kernel source before building the bonding driver. The following steps need to be done once for each kernel that is booted. For example, if the current kernel is UP (uni-processor) and an SMP (symmetrical-multi-processor) kernel is booted, these steps must be performed again to configure the kernel source for SMP before building the bonding driver for the SMP kernel. Red Hat installations If the /usr/src/linux- directory does not exist install the kernel source code per Red Hat instructions. Once installed, follow the commands listed below to configure the kernel source to match the running kernel. For Red Hat Linux 8.0 Professional: # cd /usr/src/linux- # make mrproper # make -e KERNELRELEASE=`uname -r` oldconfig # make -e KERNELRELEASE=`uname -r` dep For all other Red Hat Linux distributions: # cd /usr/src/linux- # make mrproper # make oldconfig # make dep SLES 7 installation If the /usr/src/linux- directory does not exist install the kernel source code per SuSE instructions. Once installed, follow the commands listed below to configure the kernel source to match the running kernel. # cd /usr/src/linux-.SuSE # cp /boot/vmlinuz.config .config # cp /boot/vmlinuz.version.h include/linux/version.h # cp /boot/vmlinuz.autoconf.h include/linux/autoconf.h # make oldconfig # make dep Installing Source RPM Package ============================= 1. Verify for the existence of a current version of the bonding package as follows: # rpm -q bonding If an old version of the package exists the RPM package should be removed. # rpm -e bonding Then remove the loaded bonding module. # rmmod bonding Verify that the old bonding package has been removed as follows: # rpm -q bonding 2. Install the RPM source package. # rpm -ivh bonding-.src.rpm 3. Change to the following directory and build the binary RPM for the bonding driver. For Red Hat: # cd /usr/src/redhat # rpmbuild -bb SPECS/bonding.spec For SuSE: # cd /usr/src/packages # rpm -bb SPECS/bonding.spec Note: If an error is encountered while building the driver or this directory doesn't exist, please refer to the "Kernel Source Code Setup" section of this document. 4. Install (Upgrade) the new binary RPM package using the following command. # rpm -Uvh RPMS/i386/bonding-.i386.rpm --force The "force" rpm option is required since the bonding driver is part of the kernel rpm. Bond Configuration ================== Please refer to the "Bond Configuration" and "Configuring Multiple Bonds" sections in bonding.txt to get more details on configuring single and multiple teams using the bonding driver. The section on "Switch Configuration" gives details about configuring the switch to support the load balancing modes of the bonding driver. The section on "Verifying Bond Configuration" gives details on how to verify the teaming configuration. Module Parameters ================= Please refer to the "Module Parameters" section in bonding.txt to get more details on the module parameters supported by the bonding driver. Uninstalling the RPM ==================== The following command will uninstall the bonding RPM. rpm -e bonding Hewlett-Packard Company, Copyright 2002. All rights reserved. Product names mentioned herein may be trademarks and/or registered trademarks of their respective companies